Thermalright LGA1700-BCF/AMD-ASF CPU Bending Correction Fixing Buckle CNC Aluminium Alloy bakeng sa Intel Gen 12/AMD RYZEN 7000 CPU

Tlhaloso e Khutšoanyane:

  • Thermalright LGA1700-BCF/AMD-ASF CPU Bending Correction Fixed Buckle CNC Aluminium Alloy bakeng sa Intel Gen 12/AMD RYZEN 7000 CPU
  • bakeng sa Intel 12th moloko oa CPU
  • Tlhaloso:
  • Lebitso: CPU Anti-Bending Frame
  • lintho tse bonahalang: Aluminium alloy
  • Mmala: o motšo, o moputsoa, ​​​​o khubelu, o moputsoa (ho ikhethela)
  • E sebetsa: Fana feela ka tšehetso bakeng sa Intel 12th generation CPU, motherboard CPU socket ke LGA1700, 'me chipset ke H610 B660 Z690 series.
  • Boholo: Bolelele 54mm Bophara 70mm Bophahamo 6mm
  • Boima: 'mele o moholo oa 20g; ka kakaretso 50g
  • Tlhaloso ea Sehlahisoa:
  • Thermalright e theha tharollo ea anti-bend bakeng sa li-processor tsa Intel's Alder Lake
  • Bakeng sa li-processor tsa Intel's Alder Lake li na le tšekamelo ea ho feto-fetoha le ho loana, phoso e nang le tsamaiso ea latching ea Intel LGA1700 CPU. E le ho arabela bothata bona, "anti-bend frame" e ile ea etsoa, ​​​​e etselitsoeng ho thibela ho phunya / ho kobeha ha Alder Lake CPUs.
  • LGA1700-BCF, foreimi ea aluminium e nkang sebaka sa mochini o kenyang CPU oa socket ea LGA1700 CPU ea k'hamphani. Foreimi ena e lekana ho potoloha processor mme e sirelelitsoe ka li-screw tse bonolo. Sebopeho se sebetsa le ho feta khatello ho li-processor tsa Intel's Alder Lake, ho fokotsa monyetla oa ho loana. Leha ho le joalo, bakeng sa Intel e hlokomelisa hore tharollo ena e ntseng e eketseha e ka senya waranti ea hau ea CPU, kahoo bareki ba lokela ho hlokomela sena.
  • LGA 1700 Anti-Bend Buckle e nka mokhoa oa ho qhomisa lehlabathe oa aluminium oa CNC oa anodized, o nang le boholo ba kakaretso ba 70 x 54 x 6 mm le boima ba kakaretso ba 50g. Sebaka sa eona se nepahetseng se ka qoba li-capacitor leboteng la bo-mme, 'me se sebelisa lipampiri tsa ts'ireletso tsa LOTES tsa mantlha, hape e fana ka merero e fapaneng ea mebala.
  • Ha ho bapisoa le libakete tse entsoeng lapeng tse fetileng, lesela lena la LGA 1700 le khahlanong le ho kobeha le pharaletse haholoanyane ka moralo le boleng bo betere. Ho feta moo, theko e theko e tlaase haholo. Z690, B660 le H610 liboto tsa bo-mme li ka sebelisa sekotwana sena sa LGA 1700 se thibelang ho kobeha.
  • Sebopeho:
  • 1. Papiso: Ha ho bapisoa le lihlahisoa tse ling tse tšoanang, sehlahisoa sena se sebelisa khatello ea mahlakoreng a mane ho e-na le khatello ea lintlha tse ngata, e nang le boemo bo nepahetseng, ho qoba bokhoni, e leng se loketseng ho lokisa CPU;
  • 2. Letlapa la tšireletso ea insulation: Sebaka sa ho kopana le boto e kholo ke tlase e bataletseng, 'me karolo ea pele ea LOTES ea tšireletso ea tšireletso ea boitsebiso bo tšoanang e sebelisetsoa ho fokotsa khatello holim'a boto e kholo le ho fokotsa tšitiso ea pontšo;
  • 3. Tšitiso ea pontšo: Sebaka sa tšepe se phahamisoa ho fokotsa tšitiso ea pontšo ka lehlakoreng la motherboard;
  • 4. Boitsebiso: Sesebelisoa sena sa orthotic sa CPU se na le mebala e 'meli: e ntšo le e khubelu. E entsoe ka lehlabathe le nang le anodized e phatlohang lisebelisoa tsohle tsa aluminium alloy CNC, e sebelisa letlapa la rabara ea mantlha, 'me e ts'oaroe ka li-screws tsa hexagonal socket. Ho bonolo ho e kenya mme e ka fokotsa ho kenella ha mafura a silicone moeling oa CPU;
  • 5. Tlhaloso: Ka lebaka la sekoahelo se ka holimo sa AMD Ryzen 7000 "e bōpehileng ka ho khetheha", ha o kenya radiator ka lebaka la khatello ea ho kenya, ho tla ba le oli e feteletseng ea mocheso oa silicone e fetisitsoeng, e tla bokella Gap. AMD Ryzen 7000 CPU, eo ho ka bang thata ho e tlosa, kapa esita le ho lutla ka har'a capacitor, e ka bakang kotsi ea polokeho.
  • bakeng sa AMD RYZEN 7000
  • Sebaka sa tsoalo: Mainland China
  • Nomoro ea mohlala: CPU Bracket
  • Mofuta: CPU Holder
  • Mmala: Botšo, bokhubelu (ho ikhethela)
  • Thepa: Ha ho na grease ea silicone, e nang le mafura a silicone (ho ikhethela)
  • lintho tse bonahalang: Aluminium alloy
  • Mokhoa: CNC anode sanding
  • Ho lokisa lisebelisoa: screwdriver ea mofuta oa L
  • Boholo: 70x54x6mm/2.76×2.13×0.24in
  • Boima ba 'mele: 20g, ka kakaretso 55g
  • Mokhoa oa ho kenya:
  • 1. Beha board ea mama ka holimo ho komporo ebe u bula sekotwana sa CPU
  • 2. Sebelisa screwdriver ea T20 Torx e khomaretsoeng ho tlosa karolo e ka holimo ebe u beha sekontiri se tlaase ka thōko.
  • 3. Kenya CPU
  • 4. Koahela sekoaelo se ntlafetseng sekoahelong se ka holimo sa CPU 'me u se tsamaise ka bonolo ho fihlela se tobetsa sebakeng sa sona.
  • 5. Tiisa li-screws ka lehlakoreng le fapaneng ka halofo ea ho thinya. Sekurufu se seng le se seng se nka halofo ea mothinya ka tatellano ea diagonal ho fihlela se phunyeletsoa, ​​​​se tla beha khatello ho CPU ka tsela e sa lekanyetsoang
  • Hlokomela:
  • Ntle le mafura a futhumetseng.
  • Ka lebaka la sebali se fapaneng le phello e khanyang, 'mala oa' nete oa ntho e kanna ea fapana hanyane le 'mala o bontšitsoeng litšoantšong. Kea leboha!
  • Ka kopo lumella 1-2cm e fapaneng ka lebaka la tekanyo ea litaelo.
  • sephutheloana
  • 1X Anti-Bend Frame Kit
  • 1X sebopeho sa L-screwdriver

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Lintlha Show

Thermalright-LGA1700-BCF-AMD-ASF-CPU-Bending-Correction-Fixed-Buckle-CNC-Aluminium-Alloy-for-Intel Gen (1)
Thermalright-LGA1700-BCF-AMD-ASF-CPU-Bending-Correction-Fixed-Buckle-CNC-Aluminium-Alloy-for-Intel-Gen (2)
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Thermalright-LGA1700-BCF-AMD-ASF-CPU-Bending-Correction-Fixed-Buckle-CNC-Aluminium-Alloy-for-Intel-Gen (5)
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Thermalright-LGA1700-BCF-AMD-ASF-CPU-Bending-Correction-Fixed-Buckle-CNC-Aluminium-Alloy-for-Intel-Gen

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