Thermalright LGA1700-BCF/AMD-ASF CPU Bending Correction Fixing Buckle CNC Aluminium Alloy bakeng sa Intel Gen 12/AMD RYZEN 7000 CPU

Tlhaloso e Khutšoanyane:

  • Thermalright LGA1700-BCF/AMD-ASF CPU Bending Correction Fixed Buckle CNC Aluminium Alloy bakeng sa Intel Gen 12/AMD RYZEN 7000 CPU
  • bakeng sa Intel 12th moloko oa CPU
  • Tlhaloso:
  • Lebitso: CPU Anti-Bending Frame
  • lintho tse bonahalang: Aluminium alloy
  • Mmala: o motšo, o moputsoa, ​​​​o khubelu, o moputsoa (ho ikhethela)
  • E sebetsa: Fana feela ka tšehetso bakeng sa Intel 12th generation CPU, motherboard CPU socket ke LGA1700, 'me chipset ke H610 B660 Z690 series.
  • Boholo: Bolelele 54mm Bophara 70mm Bophahamo 6mm
  • Boima: 'mele o moholo oa 20g;ka kakaretso 50g
  • Tlhaloso ea Sehlahisoa:
  • Thermalright e theha tharollo ea anti-bend bakeng sa li-processor tsa Intel's Alder Lake
  • Bakeng sa li-processor tsa Intel's Alder Lake li na le tšekamelo ea ho feto-fetoha le ho loana, phoso e nang le sistimi ea latching ea Intel LGA1700 CPU.E le ho arabela bothata bona, "anti-bend frame" e ile ea etsoa, ​​​​e etselitsoeng ho thibela ho phunya / ho kobeha ha Alder Lake CPUs.
  • LGA1700-BCF, foreimi ea aluminium e nkang sebaka sa mochini o kenyang CPU oa socket ea LGA1700 CPU ea k'hamphani.Foreimi ena e lekana ho potoloha processor mme e sirelelitsoe ka li-screw tse bonolo.Sebopeho se sebetsa le ho feta khatello ho li-processor tsa Intel's Alder Lake, ho fokotsa monyetla oa ho loana.Leha ho le joalo, bakeng sa Intel e hlokomelisa hore tharollo ena e ntseng e eketseha e ka senya waranti ea hau ea CPU, kahoo bareki ba lokela ho hlokomela sena.
  • LGA 1700 Anti-Bend Buckle e nka mokhoa oa ho qhomisa lehlabathe oa aluminium oa CNC oa anodized, o nang le boholo ba kakaretso ba 70 x 54 x 6 mm le boima ba kakaretso ba 50g.Sebaka sa eona se nepahetseng se ka qoba li-capacitor leboteng la bo-mme, 'me se sebelisa lipampiri tsa ts'ireletso tsa LOTES tsa mantlha, hape e fana ka merero e fapaneng ea mebala.
  • Ha ho bapisoa le libakete tse entsoeng lapeng tse fetileng, lesela lena la LGA 1700 le khahlanong le ho kobeha le pharaletse haholoanyane ka moralo le boleng bo betere.Ho feta moo, theko e theko e tlaase haholo.Z690, B660 le H610 liboto tsa bo-mme li ka sebelisa sekotwana sena sa LGA 1700 se thibelang ho kobeha.
  • Sebopeho:
  • 1. Papiso: Ha ho bapisoa le lihlahisoa tse ling tse tšoanang, sehlahisoa sena se sebelisa khatello ea mahlakoreng a mane ho e-na le khatello ea lintlha tse ngata, e nang le boemo bo nepahetseng, ho qoba bokhoni, e leng se loketseng ho lokisa CPU;
  • 2. Letlapa la tšireletso ea insulation: Sebaka sa ho kopana le boto e kholo ke tlase e bataletseng, 'me karolo ea pele ea LOTES ea tšireletso ea tšireletso ea boitsebiso bo tšoanang e sebelisetsoa ho fokotsa khatello holim'a boto e kholo le ho fokotsa tšitiso ea pontšo;
  • 3. Tšitiso ea pontšo: Sebaka sa tšepe se phahamisoa ho fokotsa tšitiso ea pontšo ka lehlakoreng la motherboard;
  • 4. Boitsebiso: Sesebelisoa sena sa orthotic sa CPU se na le mebala e 'meli: e ntšo le e khubelu.E entsoe ka lehlabathe le nang le anodized e phatlohang machining eohle ea aluminium alloy CNC, e sebelisa pente ea rabara ea mantlha, 'me e ts'oaretsoe ka likurufu tsa socket tse hexagonal.Ho bonolo ho e kenya mme e ka fokotsa ho kenella ha mafura a silicone moeling oa CPU;
  • 5. Tlhaloso: Ka lebaka la sekoahelo se ka holimo sa AMD Ryzen 7000 "e bōpehileng ka ho khetheha", ha o kenya radiator ka lebaka la khatello ea ho kenya, ho tla ba le oli e feteletseng ea mocheso oa silicone e fetisitsoeng, e tla bokella Gap. AMD Ryzen 7000 CPU, eo ho ka bang thata ho e tlosa, kapa esita le ho lutla ka har'a capacitor, e ka bakang kotsi ea polokeho.
  • bakeng sa AMD RYZEN 7000
  • Sebaka sa tsoalo: Mainland China
  • Nomoro ea mohlala: CPU Bracket
  • Mofuta: CPU Holder
  • Mmala: Botšo, bokhubelu (ho ikhethela)
  • Thepa: Ha ho na grease ea silicone, e nang le mafura a silicone (ho ikhethela)
  • lintho tse bonahalang: Aluminium alloy
  • Mokhoa: CNC anode sanding
  • Ho lokisa lisebelisoa: screwdriver ea mofuta oa L
  • Boholo: 70x54x6mm/2.76×2.13×0.24in
  • Boima ba 'mele: 20g, ka kakaretso 55g
  • Mokhoa oa ho kenya:
  • 1. Beha board ea mama ka holimo ho komporo ebe u bula sekotwana sa CPU
  • 2. Sebelisa screwdriver ea T20 Torx e khomaretsoeng ho tlosa karolo e ka holimo ebe u beha sekontiri se tlaase ka thōko.
  • 3. Kenya CPU
  • 4. Koahela sekoaelo se ntlafetseng sekoahelong se ka holimo sa CPU 'me u se tsamaise ka bonolo ho fihlela se tobetsa sebakeng sa sona.
  • 5. Tiisa li-screws ka lehlakoreng le fapaneng ka halofo ea ho thinya.Sekurufu se seng le se seng se nka halofo ea mothinya ka tatellano ea diagonal ho fihlela se phunyeletsoa, ​​​​se tla beha khatello ho CPU ka tsela e sa lekanyetsoang
  • Hlokomela:
  • Ntle le mafura a futhumetseng.
  • Ka lebaka la sebali se fapaneng le phello e khanyang, 'mala oa' nete oa ntho e kanna ea fapana hanyane le 'mala o bontšitsoeng litšoantšong.Kea leboha!
  • Ka kopo lumella 1-2cm e fapaneng ka lebaka la tekanyo ea litaelo.
  • sephutheloana
  • 1X Anti-Bend Frame Kit
  • 1X sebopeho sa L-screwdriver

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

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Thermalright-LGA1700-BCF-AMD-ASF-CPU-Bending-Correction-Fixed-Buckle-CNC-Aluminium-Alloy-for-Intel Gen (1)
Thermalright-LGA1700-BCF-AMD-ASF-CPU-Bending-Correction-Fixed-Buckle-CNC-Aluminium-Alloy-for-Intel Gen (2)
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Thermalright-LGA1700-BCF-AMD-ASF-CPU-Bending-Correction-Fixed-Buckle-CNC-Aluminium-Alloy-for-Intel-Gen (5)
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Thermalright-LGA1700-BCF-AMD-ASF-CPU-Bending-Correction-Fixed-Buckle-CNC-Aluminium-Alloy-for-Intel-Gen

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